U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT

Model: UVCP

Category: Electrolytic Plating Equipment

Booth No: TBA

Characteristic

-Specially for SAP and MSAP process of IC substrate i.e. Flip Chip BGA, CSP, FC CSP, it can be collocated with resister plating process. -One fixed size of frame to assist production and transportation without touching panels to get better plating quality of pattern. -Use 6 axis robot with CCD to detect edges of panels accurately. -Unloading M/C to unload panel automatically to save manpower. -For extra fine pattern: LW/LS :12/ 9 μm -Uniform distribution of plating quality. -Remarkable throwing power for extra fine pattern on thin board, blind via filling and through hole filling. -Modular design fulfill different requirement of production. -Auto. online chemical stripping. -Easy operation and maintenance.