DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
Model: DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQ
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
ts design is to replace conventional lines and solve problems of panel fall and chemical contamination, design of dual tracks can increase capacity; competitive price will be low down production cost, it’s easy for operation and maintenance, matching with PC automatic system applying to Cu plating on PCB and good performance for throwing power of BVH and PTH, etc.
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