VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT (DOUBLE TYPE)
Model: VCP(DT)
Category: Electrolytic Plating Equipment
Exhibitor: APPLIED EQUIPMENT LIMITED
Booth No: TBA
Characteristic
*Apply to panel and pattern plating process *Double track design increase double capacity but occupy less space *Use six axis robot with CCD to detect edge of panel accurately *Unloading M/C to unload panel automatically to save manpower *No auxiliary frame and jig to be used for board thickness 0.06~ 1.6 mm during production *Uniform distribution of plating quality *Remarkable throwing power of high aspect ratio for through hole, blind via , via filling and through hole filling process *Modular design can fulfill customers’ requirements *Auto. chemical online copper stripping *Easy operation and maintenance
Other Products
-
TETRA 1.5 GERMANY DIENER PLASMA FULLY AUTOMATIC INLINE SYSTEM
-
CCD Full Automatic Trimming Machine
-
Roll to Roll CCD Printing Drying Line
-
AOI/AVI
-
Automatic Vision Inspection System(AVI)
-
Vacuum Holes Plugging Machine with CCD Alignment
-
New generation tray type conveyor
-
ThermoFisher X-Ray diffraction (XRD)
-
Technical & Try LUP-P-B-2M-R Leak Sensor
-
High Precision Routing Machine
Products you may be interested in
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
STANDARD VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
U-TURN VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT(DOUBLE TYPE)
-
Vertical Continuous Copper Plating Equipment
-
DOUBLE TRACK VERTICAL CONTINUOUS COPPER PLATING EQUIPMENT
-
Anode basket
-
VCP on-line rack monitoring system
-
pe- pulse reverse rectifier
-
Immerison Bus Bar
-
pe- DC power supply
