Horizontal Electroless Copper

Model: Printoganth U Plus / P Plus / T1 / P2

Category: Alkaline Palladium Base Electro-Less Copper Process

Booth No: TBA

Characteristic

‧ Printoganth T1: meets the needs of advanced HDI applications using amSAP production technologies. Offering exceptional throwing power and coverage of challenging blind microvias, in combination with optimized copper thickness uniformity, Printoganth T1 enables sub 30μm features when used with pattern plating electrolytes. Compatible with a wide range of dielectric materials, including BT and PI, and with an optimized internal stress level, Printoganth T1 exhibits best in class copper adhesion making it the ideal electroless copper process for next generation mobile device PCBs. ‧ Printoganth P Plus: offers very good adhesion and no blistering even on the smoothest substrates due to its controlled internal stress characteristics. It is therefore the best choice for flex / flex-rigid production and MLB / HDI manufacturing on demanding base materials such as PTFE or BT. ‧ Printoganth P2: the latest update to the Printoganth P series and improves over the current Printoganth P Plus process with an increased throwing power and a wider compatibility to via fill electrolytes. ‧ Printoganth U Plus: ideally suited for the production of high layer count PCBs utilizing multiple inner layers and advanced HDI any-layer, or ELIC technologies. As the market leading high reliability electroless copper process Printoganth U Plus produces excellent copper to copper interconnections resulting in the best reliability performance even under severe thermal shock conditions. With over 80 installations, and an installed capacity in excess of 25 million m2/year Printoganth U Plus has an unrivalled customer base within leading global HDI PCB manufacturers.

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Horizontal Electroless Copper

Characteristic

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