Multilayer Inductive Bonding

 

Model: Bonding 168, Bonding 200, Bonding 211

Category: Rigid Board

Exhibitor: TAIWAN KONG KING CO., LTD. (TKK)

Booth No: TBA

 

Characteristic

 

By inductive-magnetic heating system, there's no limit on layer-count. The most advanced 8G induction bonding system is faster in heating rate 50% more than previous generation with a low-power consumption.

 

Other Products

 

• 

  Panel Clean Machine

• 

  Automatic slice grinder

• 

  Optical Inspection Uncollimated Exposure Units (for Inner layer)

• 

  SPINDLE SPARE PARTS

• 

  High Speed Automatic L/UL Guide Hole Puncher

• 

  COPPER OXIDE

• 

  日本 SANSO PUMP PHSZ-7533 耐酸鹼泵浦

• 

  Core Layer

• 

  Laser applications

• 

  Daidalos-NEW COPPER FILTER

 

 

 

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