BGA/CSP/FCCSP/WLCSP

 

Model: 無

Category: Rigid Board

Exhibitor: UVAT Technology Co., Ltd.

Booth No: TBA

 

Characteristic

 

For the line.layering.via filling and through from the process.It can save the cost from the material and process and use low production costs ofin-line sputter system for the high technological process.

 

Other Products

 

• 

  Precision Coated Drill HAC series

• 

  Four Wire Easy-Setup Automatic Tester

• 

  adhesive roller

• 

  Drill bit

• 

  RTR VACUUM LAMINATOR

• 

  Instruments for PCB and Wafer Testing

• 

  Stencil Laser Equipment

• 

  Direct Imaging Systems

• 

  Computer Integrated Manufacturing system

• 

  AGV & auto-packing planning/implementing

 

 

 

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