Nickel / Palladium / Gold (ENEPIG) and Palladium/ Gold (EPAG)

Model: Pd tech PC / Pd core，Aurotech G-bond 2 / G-bond 3

Category: Electroless Palladium Plating Solution

Booth No: TBA

Characteristic

‧ Pd tech PC: It is the most widely used pure palladium-type of ENEPIG process in PCB production. It can be used with any medium-phosphorus nickel product and mixed reaction immersion gold bath. It has the advantages of high operational stability, stable deposition rate performance and long bath life. ‧ Pd core: A new generation of chemically pure palladium system, which can be used with any medium-phosphorus nickel product and mixed reaction immersion gold bath to produce ENEPIG or nickel-free EPAG products. The configuration of low precious metal concentration can effectively reduce configuration and production costs, with stable deposition rate performance and high operational stability. ‧ Aurotech G-Bond 2: It is a mixed reaction immersion gold bath. It can be used in ENIG, ENEPIG and nickel-free EPAG processes. It can significantly reduce nickel layer defects and provide excellent solderability and wire bonding requirements. This product is significant cost savings by low Au?content, high bath stability, and good uniformity. ‧ Aurotech G-Bond 3: It is a mixed reaction immersion gold bath. It can be used in ENIG, ENEPIG and nickel-free EPAG processes. It can significantly reduce nickel layer defects and provide excellent solderability and wire bonding requirements. This product is significant cost savings by low Au?content, high bath stability, and good uniformity. Aurotech G-bond 3 is an environmentally conscious product that does not addition of additional stabilizer KCN. Features and benefits: ‧ Very good solder wetting ‧ Outstanding solder joint integrity ‧ Excellent aluminum/gold-wire bonding capabilities ‧ Lower precious metal costs ‧ Higher thickness of Pd/Au (>0.1um) ‧ Pass the Ni corrosion of IPC 4552B in Aurotech G-Bond 2/3 ‧ Based on Atotech’s extensive ENIG/ENEPIG/EPAG production experience

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Nickel / Palladium / Gold (ENEPIG) and Palladium/ Gold (EPAG)

Characteristic

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