Micromaterial processing with Laser Technology
Model: LPKF ProtoLaser U4
Category: Circuit Board Processing
Exhibitor: MICROSYS ENGINEERING CO., LTD.
Booth No: TBA
Characteristic
The LPKF ProtoLaser U4 uses a UV laser source. Many material groups are easy to process at these wavelengths – without additional tools, masks, or films. The LPKF ProtoLaser U4 builds on the success of its predecessor and expands its range of applications with targeted innovations.
Other Products
-
Automated Optical Shaping
-
wheel blade
-
Oxide Part A
-
LaserVia AOIM
-
無
-
AOI LAMP
-
Dynamic Mechanical Analysis
-
Automatic PC Board Ringloading Machine
-
Automatic PC Board Ringloading Machine
-
Flash Etching in SAP
Products you may be interested in