Micromaterial processing with Laser Technology

 

Model: LPKF ProtoLaser R4

Category: Circuit Board Processing

Exhibitor: MICROSYS ENGINEERING CO., LTD.

Booth No: TBA

 

Characteristic

 

Laser Ablation with Virtually No Heat Input In laser technology, the shorter the pulse, the lower the heat input into the surrounding material. A picosecond laser breaks down an important barrier. It practically eliminates heat transfer; the targeted material evaporates immediately. Proven Housing The new ProtoLaser R is packaged in the familiar thirdgeneration ProtoLaser system housing. It is structurally decoupled from the effects of the environment and can be rolled through any lab door. Micro-Material Processing Specialist Unlike pure cutting applications, micro material processing does not require high powers. Instead, stable laser parameters in the lower output range are crucial. The LPKF ProtoLaser R features a laser source with a laser power of up to 4 W. This allows even complex thin film systems, temperature-sensitive substrates, and OLED coatings on glass to be ablated or structured with a high degree of control. The laser system requires no masks or films to accomplish these tasks. Established System Software The LPKF ProtoLaser R comes with tried and true system software. Support of all common CAD formats is enabled through the combination of LPKF CircuitPro and LPKF CircuitMaster. Picosecond laser for the research lab Cold ablation of different thin-film-layers Intuitive CAM software Field-proven housing concept

 

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