Super Thin Copper Foil for IC substrate has launched !
Exhibitor: TOP Nanometal Corporation
Date: 2023-11-10
Booth No.: K-230
Topnano launches new product: Super Thin Copper Foil for IC substrate .
This product is made of 18um copper carrier foil and 3um ultra-thin peelable copper foil.
It is suitable for mSAP semi-additive process in PCB manufacturing, recommended line width/space (L/S) ≒40/40 for fine line substrate application.
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