Innovative Roll-to-Roll Sputtering Technology Delivers Thinner, Higher Performance Electromagnetic Shielding Solutions Roll-to-roll sputtering electronic materials manufacturer TOP Nanometal Corp. is supplying roll-to-roll sputtered adhesiveless ultra-thin copper FCCL products, providing breakthrough solutions for flexible electromagnetic interference (EMI) shielding applications. This product uses TOP Nanometal's roll-to-roll sputtering process to directly deposit micron-level ultra-thin copper layers onto polyimide film (PI film) substrates, eliminating the adhesive layer required in traditional FCCL products. The adhesiveless structure significantly reduces the overall material thickness while maintaining excellent flexibility, making it particularly suitable for electronic product applications requiring bending, high-temperature resistance, and emphasizing thinness. TOP Nanometal Corp. states: "Our adhesiveless ultra-thin copper FCCL brings thinner, higher-performance EMI shielding solutions to flexible electromagnetic shielding technology. By directly bonding ultra-thin copper layers to PI film through R2R sputtering technology, we have successfully addressed the thickness limitations and high-temperature adaptability issues associated with traditional adhesive layers, providing customers with thinner, more reliable EMI shielding solutions." Product Features and Advantages *Ultra-thin Structure: Adhesiveless design significantly reduces overall thickness, suitable for precision electronic devices with space constraints *Excellent Flexibility: Capable of multiple bends without affecting performance, supporting innovative flexible electronic designs *Superior Heat Resistance: Adhesive-free composition greatly enhances stability and service life in high-temperature environments *Highly Customizable: Can be further processed after purchase to plate nickel, tin, gold, or other metal layers, optimizing resistance values and EMI shielding performance