布局5G高頻應用 金居明年進收割期
Date: 2019-06-14
News Type:
〔記者卓怡君／台北報導〕PCB上游銅箔材料廠金居（8358）因中國銅箔廠商殺價競爭，加上客戶消化庫存，今年以來營收較去年下滑，金居董事長宋恭源表示，公司積極布局5G高頻高速材料，進行產品差異化，相關5G產品陸續通過大廠認證，第4季將開始出貨，明年進入收割期。
金居昨日召開股東會，宋恭源指出，銅箔行業因過去2、3年中國同業大幅投資擴產，導致一般銅箔產品供過於求，價格壓力大，3年前金居決定走「小而美」的路線，以高品質的產品為主，並卡進高頻高速領域，近來已陸續開發出相關產品，取得世界級一線大廠的認證，第4季開始出貨。
宋恭源預估，2020年起，5G等新品比重可望拉高，金居的銅箔產品可在同業間脫穎而出，有別於一般銅箔廠，藉此再創金居新的巔峰，並擺脫因中國廠商漫無目的投資，造成市場供過於求的泥淖。
下半年可望接急單
對於未來展望，宋恭源認為，外部大環境因美中貿易戰有很多變數，但下半年應會有急單出現。(新聞來源:自由財經)
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