【行業亮點】台虹 深耕5G高頻高速材料
Date: 2018-10-01
News Type:
軟性銅箔基板（FCCL）暨太陽能背板供應商台虹深耕modified PI（異質PI）、LCP（液晶材料）等材料，為即將進入的5G時代做好準備。法人也指出，公司針對智能型手錶和陸系手機市場持續開發高頻FCCL，加上逐漸淡出太陽能背板事業，可有效改善公司營運表現，相關效益有望在年底前能顯現。
業界分析，異質PI符合5G高頻高速需求，價格也相對便宜，由於LCP基材本身價格偏高，上游原物料也在漲，部分製程特殊的LCP基材，除了需要購買新設備外，還需考量生產良率不穩定的因素，因此能沿用原製程的異質PI脫穎而出，預計至少能立足於市場兩年以上。
產能方面，公司日前增加2條塗佈線，更斥資10億新台幣在大陸南通設廠，以生產鋁塑模、FCCL電子材料為主，預計2019年第1季完工，第2季底可投產並正式貢獻營收。 (新聞來源：工商時報)
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