MWC 2018倒數 台積、聯發科就戰略位置
Date: 2018-02-27
News Type:
2018全球行動通訊大會（MWC）大會各國際大廠秀出科技新技術，往往成為未來時代趨勢潮流，今年5G及人工智能議題仍獨領風騷，相機鏡頭、無線充電、無線傳輸等商機也正逐漸茁壯，台灣半導體龍頭台積電、聯發科將優先受惠。
今年MWC大會5G與人工智能仍是展中兩大亮點，手機芯片巨擘高通最新款驍龍845芯片搭載AI引擎處理能力，也展示新階段5G新空中接口技術藍圖擴展行動生態體系，競爭對手聯發科在AI及5G佈局也不落人後，4G持續推出具低成本功耗優勢產品，在2020年有5G產品商業化，今年上半年也將推出人工智能新產品，強打多功能、低功耗。
高通與聯發科均為台積電客戶，台積電看好未來5G及人工智能趨勢，目前通訊類產品佔整體營收59%，今年高通新款芯片也將回歸台積電生產，台積電在5G時代來臨，成為最大贏家，另外，人工智能逐漸應用在各領域，也帶動台積電在高速運算強勁成長。
另外，從蘋果到非蘋陣營無線充電成為顯學，目前台廠IC設計均已備妥5瓦至15瓦無線充電解決方案，且通過WPC聯盟認證，可望優先搶食非蘋陣營無線充電商機。相機鏡頭仍是手機差異化最顯著部分，代理索尼CIS組件尚立及致新的鏡頭音圈馬達、防手震未來大有可為。無線傳輸中隨著規格提升從802.11n走向11ac，未來更朝向11ax邁進，瑞昱、立積、笙科將持續受惠。 (數據源：聯合晚報)
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