金價跌、通訊訂單回溫 IC封測第二季業績旺
Date: 2013-04-18
News Type:
儘管近年來封測廠積極轉進銅製程、乃至合金凸塊等黃金材料的應用，以規避金價波動風險，不過實際上黃金仍是封測業相當重要的原料，國際黃金價格從4月初開始急跌，對於黃金消耗「大戶」的IC封測產業而言，Q2毛利率將獲提昇空間，再加上通訊IC需求已開始回溫，在智慧型手機、平板電腦新機上市助陣之下，LCD驅動IC需求持續轉強， 包括日月光、矽品、頎邦等IC封測大廠本季展望轉佳，營運狀況浮現利多空間。(資料整理：鉅亨網)
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