【行業亮點】華通吃蘋果 營運加速回溫
Date: 2017-03-20
News Type:
PCB大廠華通歷經體質調整，今年營運將隨積極切入下世代iPhone類載板（SLP）新商機而加速回溫。業界看好，下世代電子產品的電路板設計朝向細間距（fine pitch）發展已是主流趨勢，此部分技術進入門坎高，華通在高階HDI細線路累積豐富經驗，有助於切入類載板PCB新應用領域。反映市場需求提升，以及HDI製程應用出貨成長，華通今年前二月累計營收則為75.48億新台幣，年增逾19%。
市場盛傳已久，蘋果有意將下世代新機主板變更為HDI類載板的設計。分析師普遍看好，華通因坐擁高階的HDI、軟硬複合板兩大類技術的優勢，因此有助於未來新品訂單的爭取，列入蘋果六家類載板供貨商名單之一。
另一方面，華通已敲定研發主管異動案，由副總裁吳彭弘接任研發主管一職，補足研發主管職缺。據了解，華通歷年研發經費約佔總資本支出個位數百分比。華通當時公告說明，研發主管原先由江培琨總裁兼任，因職務調整，改由副總裁吳彭弘接任。 (新聞來源：經濟日報)
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