金安國紀擬收購杭州聯合電路板公司
Date: 2016-02-24
News Type:
金安國紀2月21日晚間披露，公司當日與杭州聯合電路板有限公司及田軍簽署了《關於杭州聯合電路板有限公司之股權轉讓框架協議》。公司擬對田軍所持有的杭州聯合電路板有限公司100%股權進行收購。
金安國紀稱，本次收購的目的主要是為公司覆銅板新產品試驗擔負實驗工廠的作用。通過 PCB 生產比較 成熟的杭州聯合電路板在 PCB 行業中對公司研發的覆銅板新產品進行試用 和完善，直接接觸 PCB 下游客戶(覆銅板產品的直接使用客戶)，使公司研發出 更多、更新、性價比更高、能適應各種客戶需求的覆銅板新產品，進一步擴大中 高等級覆銅板產品的市場份額，以實現強化公司規模優勢和行業影響力的目的。(新聞來源：中國證券網)
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