金居產能高檔 本季拚轉盈
Date: 2015-12-30
News Type:
在光寶集團進駐滿周年後，對PCB上游廠商金居開發的助益逐漸浮現，金居力拚第4季轉盈，最快2016年下半在氧化銅粉部分切入軟板、HDI新應用，提升營運動能。
金居表示，隨著生產管理上軌道、開拓新應用及美元走強挹注，預料第4季將是近年營運最好的一季。據瞭解，金居銅箔廠單月產能約1,400噸，隨著客戶認證過關、銅箔新應用開發與導入客戶產線，帶動本季產能利用率維持在九成以上。
金居今年在PCB硬板與銅箔基板（CCL）客戶需求仍穩下，年增達23.7%，創近三年同期新高。金居指出，目前仍以生產電解銅箔為主，至於高純度電子級氧化銅粉，則積極開拓在高密度連接板（HDI）等方面的新應用，佈局效益將在明年下半年明朗。(新聞來源：中時電子報)
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