中芯華為高通聯手研發積體電路
Date: 2015-06-24
News Type:
6月23日，中芯國際積體電路製造有限公司，中國內地規模最大、技術最先進的積體電路晶圓代工企業，與全球領先的資訊和通信解決方案供應商華為、全球領先的微電子研究中心之一比利時微電子研究中心(imec)、全球最大的無晶圓半導體廠商之一 Qualcomm Incorporated 的附屬公司 Qualcomm Global Trading Pte Ltd在人民大會堂舉行簽約儀式，宣佈共同投資中芯國際積體電路新技術研發(上海)有限公司，開發下一代 CMOS 邏輯工藝，打造中國最先進的積體電路研發平臺。
據悉，目前以14納米先進邏輯工藝研發為主，研發將在中芯國際的生產線上進行。且中芯國際將有權獲得新技術研發公司開發的先進工藝節點量產技術的許可，這些技術可以應用於中芯國際目前及未來的各種產品，或用以服務中芯國際與其他公司的業務，帶動大陸國內積體電路整體技術水準，達成《國家積體電路產業發展推進綱要》提出的2020年16/14納米工藝實現規模量產的目標。也將進一步提升中國積體電路製造業的核心競爭力。(新聞來源：百能網)
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