奧特斯重慶廠擴建 佈局新一代項目
Date: 2015-05-05
News Type:
近日，奧特斯集團董事會正式決定向重慶增資擴建。截止2017年中期，計畫增資額將陸續從當前的3.5億歐元擴大至4.8億歐元。 為保持在高端市場獲得長期持續的盈利，奧特斯將通過對新一代高端印製電路板的產能擴建，進一步挖掘市場契機。該產品被稱為系統級封裝印製電路板（substrate-like PCBs）。
據悉，擴建的重慶二期項目預計於2016年下半年投產，並基於上海與重慶兩地工廠在技術，流程工藝及管理水準三方面的緊密合作。系統級封裝印製電路板的技術開發已在上海進行且於今年完成首批量產。此外，重慶半導體封裝載板專案現處於產品認證階段，計畫於2016年投產，當年即可產生收益。 (新聞來源：美通社)
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