行動通訊熱 欣興景碩南電積極擴產
Date: 2015-02-26
News Type:
看好行動通訊，欣興、景碩今年資本支出各約100億元、40億元，已是連續第3年維持歷史高峰水準，南電今年確定跟進，將使3大積體電路（IC）基板廠資本支出躍增，達到過去5年來的高峰期。
景碩繼去年資本支出約50億元創歷年新高，公司表示，今年也維持前年約40億元的水準，新豐新廠將在第3季量產，ABF、BT等材質均會生產，新豐新廠也布局為高階積體電路（IC）基板生產基地，為更高精密度16奈米、14奈米的半導體製程做好準備。
欣興對新廠產能等細節相當低調，但董事長曾子章強調，FC-BGA新廠將爭食新客戶的雲端商機，包括雲領域伺服器及端領域的手持式裝置，同時也為未來新世代技術做準備，導入20奈米以下的IC基板製程。
南電今年開啟大規模資本支出計畫，主要鎖定錦興廠區，將加快腳步趕在年底投產。(新聞來源：中時電子報)
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