華通將在重慶投資HDI手機板廠
Date: 2012-11-23
News Type:
老牌PCB廠華通近日宣佈，將投資約3億美元在重慶涪陵投資設立新廠，華通將在此設立HDI制程的手機板廠，主要生產智慧手機、掌上型電腦等手提電子產品所需的高技術印刷電路板。據悉，該項目最快2014年Q1投產，預計首期開出的產能為每月25-30萬尺，年產值將突破20億元人民幣。（來源：PCB資訊網）
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