同泰明年新產能開出 營運添動能
Date: 2014-12-11
News Type:
興櫃新兵同泰主要生產軟性印刷電路板(FPC)，大股東包含欣興、臺表科、先豐，公司表示，登錄興櫃後將朝上市掛牌邁進，目前月產能4.5萬平方米，臺中新廠規劃明年第三季投產加入生產行列，屆時月產能將增為5.7萬米平方。
同泰大股東包含欣興持股36.38%比重最高，其次臺表科持有28.42%、先豐0.58%，大股東涵蓋IC載板以及通訊基地臺電路板大廠，公司表示，大股東實力堅強且股權集中，將為公司帶來穩定發展強力後盾。
目前產品應用範圍包含電子3C、車載、工控等，客戶主要為國內外液晶顯視器模組、背光、觸控等知名大廠；為因應終端需求變化與客戶訂單，公司投入發展高密度、細線路及微孔洞等高階產品，並投入擴產規劃，新廠預計明年第二季建置完畢、第三季正式投產，預計臺中新廠月產能1.2萬平方米。
展望未來，將以機器人、車用電子及手機用軟硬結合板為發展重心；同泰已與日系客戶進行技術合作，朝小型自動化機器所須使用的軟板產品為開發重點，車用電子持續朝車用影音娛樂系統相關軟板開發製造，並與歐系OEM車燈大廠合作開發專供特殊車燈所使用的高耐熱材料軟板。(新聞來源：聯合新聞網)
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