ISOLA推新浸漬專利，可有效緩解CAF失效
Date: 2014-04-17
News Type:
專門製造及生產多層印刷電路板(PCB)的ISOLA 4月8日宣佈將推行一項技術專利項目，能夠減少固化樹脂電介質中的空隙數量，緩解陽極導電絲(CAF)在製造PCB時遇到的技術問題，採用該技術後可生產出高品質樹脂浸漬的預浸料，大幅減少空隙，提升PCB穩定性，並減低安全風險。 透過ISOLA專利技術，提供的層壓板浸漬工藝，可生產出高品質、樹脂浸漬的預浸料，大幅減少空隙，緩解CAF失效問題，而這項適用於全世界的層壓板和預浸料製造商及用戶，美國專利號為6,083,855，臺灣專利號為 I230657，並已在其他若干國家申請了技術專利。據ISOLA執行副總裁和首席技術官Tarun Amla表示，電子設備製造當前的趨勢是向更小、更薄、更輕、更高性能方向發展，導致PCB中的互聯鑽壓孔之間的間隙更小，而電介質中的空隙如同CAF電流路線中的導體，會導致早期失效並產生嚴重的穩定性及安全性風險，透過一種有效的風險緩解技術，將可減少或消除浸漬工藝中產生的空隙。(來源：HKEPC新聞中心)
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