Immersion Tin

Model: Stannatech / Stannatech Flex / Stanna CAT

Booth No: TBA

Characteristic

‧ Stannatech: The Industry benchmark for Immersion Tin for multiple Pb-free soldering and press-fit technology. Within the electronics industry immersion tin is recognized as a reliable surface finish for both PWBs and IC substrate applications. It is used in many market segments, such as automotive, communications, consumers and industrial electronics. ‧ Stannatech Flex: A new immersion tin finish for flexible substrates application and provides excellent performance on fine line structures. The bath works well with Atotech’s CrystallizerR equipment which allows a tight control range of the copper content in the plating bath and by that an increased bath life with no need for any feed and bleed processing. ‧ Stanna CAT: A new autocatalytic tin process, which allows the tin deposition on copper or other metal substrates without any limitation on the tin thickness. With these unique properties the process opens up new opportunities for tin plating in new applications such as μ-LED, IC substrates, or solder depot plating. The tin layer is even and homogeneous in the crystal structure and can be deposited with layer roughnesses of below 150 nm Ra. With more than 160 Installations, Stannatech is the mostly used immersion tin process worldwide. Stannatech can be run in vertical and horizontal mode. Atotech has the advantage that with regard to horizontal tin plating it can offer the Stannatech Horizon System, which provides both, chemistry and equipment from one hand. High bath stability combined with consistent plating quality due to the support of peripheral equipment like Crystallizer and Constannic. Whisker growth is reduced well below IPC's specification with the 'Anti-Whisker Additive' (AWA) and meets demands of the automotive industry. Surface contamination, which is critical for immersion tin baths can be dramatically minimized by using a special process step, Ionix SF. Yellowing of the tin surface due to the harsh conditions during Pb-free soldering in an air environment is avoided with PostDip 270. Ionix SF is a standard process step for Stannatech horizontal and vertical, whereas PostDip 270 is offered optionally to Stannatech Horizon. Features and benefits ‧ Smooth deposit with homogeneous thickness ‧ Compatible with Atotech’s auxiliary equipment such as Crystallizer and Constannic ‧ Anti-Whisker Additive to prevent whisker growth ‧ Fine line capable to 10 μm L&S ‧ Specific soft etch system for best performance

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Immersion Tin

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