Horizontal Panel / Pattern Plating
Model: Inpulse 2HF / Inpulse 2THF / Via2
Category: Copper Anode
Exhibitor: ATOTECH TAIWAN LIMITED
Booth No: TBA
Characteristic
Inpulse 2HF - Blind Micro Via Filling The Inpulse 2 system is production proven for BMV filling with simultaneous conformal plating of through holes. The combination of the Atotech inert anode / redox system and the InPulse 2HF electrolyte ensures long lifetime in full production. The process can be used for BMV-filling with simultaneous through hole conformal plating or for BMV-filling alone. Inpulse 2THF Filling of through holes with electrolytic copper is a new capability which can replace current resin plugging processes. Inpulse 2THF reduces process steps required for filling and can significantly reduce costs and increase yields. Filling through holes with copper gives improved thermal characteristics and also CTE matching in comparison to standard techniques. The process is a single treatment wet to wet metallisation and filling which means reduced handling and improved yields. The Inpulse 2THF electrolyte together with the unique Uniplate InPulse 2 System is ideally suited for through hole filling especially for thin core material with copper foil thickness less than 5μm. Via2 Technology - Copper Trench Filling for Ultra Fine Lines Via2 is an innovative technology that utilizes laser ablation techniques, together with specially developed plating processes, to form electrical paths for signal propagation within the dielectric, as opposed to conventional lithography based technologies that form signal paths on the surface of the dielectric layer.
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