Anti-folding FCCL

Model: Anti-folding FCCL

Booth No: TBA

Characteristic

-This product is one of main upstream materials of FPC (Flexible Printed Circuit). -2-Layer FCCL without adhesive between PI and copper, can be used for advanced FPC manufacturing, such as fine pitch FPCs and tape COF FCCLs. -To prevent folding, we recommened use 50um PI or 38um PI for FPC. -Using R2R vacuum sputtering process and electroforming process. -Copper thickness is only 9um, suitable for fine pitch (Pitch<30um) layout design. -By vacuum sputtering process have merits such as good uniformity of metal layer, productive, good adhesion, and high hardness. -Optical grade Polyimide substrates available for selection.