Polyimide Film Sputter Copper

Model: Polyimide Film Sputter Copper

Booth No: TBA

Characteristic

*Using Roll to Roll(R2R) vacuum sputtering and chemical electroforming(electroplating) processes *Copper thickness is between 2um and 8um, suitable for fine pitch (Pitch<30um) layout design. *We have optical grade Polyimide Film,if customer want to use their own PI materials, he can email to discuss. *Product features include: high heat resistance, fine flexural/bending endurance, good peel strength, copper layer uniformity, and dimensional stability. *Application (Final products)：FPC (Flex pcb),EMI Shielding Film,Conductive materials,Electronic materials for heat resistance...