MEI HO ENTERPRISE CO., LTD.

Booth No: K-631

Exhibitor Profile

Mei-Ho Meihe Enterprise Co., Ltd. established the PCB Abrasive Materials Division in 2008, and cooperated with Nikken Japan Paper Research Co., Ltd. to develop HDI / IC /FC high-order carrier materials. In 2012, we added a subsidiary in Dongguan, Dongguan City. Research Optoelectronics Co., Ltd., FPC Soft Board Division, Wafer Semiconductor Division, Mei-Ho have now spanned a number of industries, including the development and sales of precision grinding machine tools, electronics, wafer grinding materials and photovoltaic materials. The main products are: grinding equipment, ceramic & non-woven brush wheel, pressed steel plate, burned iron plate, aluminum foil plate, silicone cushion, high and low temperature pressure buffer material, vacuum air bag, Teflon fiberglass cloth, wafer Grinding wheel, etc.