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NIDEC ADVANCE TECHNOLOGY TAIWAN CORPORATION

Area: Dry / Wet Process Equipment

Booth No: M-1326

Website: https://www.nidec-read.co.jp

Exhibitor Profile

IC Substrate, such as FC-BGA, FC-CSP, Wire Bond BGA/CSP/MCM) and HDI PCB 4wire test system. Precise 4-wire/2-wire fixtures for IC substrate, HDI PCB, FPC, TAB, FPD, such STN, OLED, etc., manufacturing and sales. IC substrate and HDI PCB testing service. T

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