Topnano Showcases Flexible Ultrathin Nanometal Films at COMPUTEX 2024
Exhibitor: TOP Nanometal Corporation
Date: 2024-05-24
Booth No.: K-230
TOP Nanometal Corp, a manufacturer specializing in flexible substrate materials, is set to exhibit its latest products at the upcoming COMPUTEX 2024. The exhibition will take place from June 4th to 7th at Taipei Nangang Exhibition Hall 1.
Product Highlights:
1.Copper Foil sputtered Graphite Thermal Film:
This electronic thermally conductive material has excellent heat dissipation performance and is suitable for heat dissipation applications of various flat and thin electronic parts and products. Whether it is a high-performance but easy-to-heat SSD, a VR/MR viewing helmet, or a thin and light notebook, you can get the cooling effect from this thermal materials.
2.Ultra Thin FCCL (2L-FCCL):
This kind of flexible substrate has no glue between the base PI/PET material and the copper layer, making it an ideal choice for flexible electronic products that emphasize thinness and lightness. The copper layer can be supplied in 2~18um.
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