Orbotech Magna™ Solution
Exhibitor: KLA Taiwan
Date: 2021-12-21
Booth No.: N-1319
- Advanced inkjet printing for IC packaging (dams, insulation layers and more)
- Hight throughput, high accuracy and low total cost of ownership (TCO)
- Compact system. Supports strip, panel, JEDEC tray, wafer
- Powered by Orbotech’s groundbreaking Structural Printing Technology™ and field-proven DotStream Pro Technology™
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