陸銅箔低價戰 台廠另覓出路
Date: 2013-08-29
News Type:
樂思化學出版OSP性能指南-提高良率，改善品質，獲得驗證的可靠性美國康涅狄格州西漢文(2013年8月22日)訊 – 樂思化學最近出版了有機保焊膜(OSP)性能指南，協助OEM、EMS以及印製電路板生產商簡易地確定如何在整個供應鏈中顯著提高良率，改善品質以及提升可靠性，並且大幅減少重工和不良率。具體來說，該指南針對業界主要OSP制程 — ENTEK® PLUS HT、其他競爭OSP以及冒牌OSP制程進行比較，並提供了可信的資料。
如指南中所述，ENTEK PLUS HT具有超越競爭者OSP制程達60%之卓越的沾錫性能，沾錫速度更快，沾錫力最大值明顯更高。這些都是ENTEK PLUS HT具有對銅面優異的保護性以及維持其可焊性的關鍵指標，並已廣為業界所接受。本指南還詳盡地介紹了波峰焊爬錫性能、多次無鉛回流後的外觀、電測(ICT)可靠性以及錫球剪切強度的測試結果。
ENTEK PLUS HT OSP性能指南備有英文版和簡體中文版，可電郵至entek@enthone.com索取。
如需驗證您的OSP制程，敬請流覽http://enthone.cn/ENTEK_PLUS_HT。（來源：樂思化學）
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