覆晶基板接單創新高 景碩Q3業績可期
Date: 2013-08-22
News Type:
景碩受惠於聯發科、高通的手機晶片出貨放量，其手機晶片及ARM應用處理器採用的晶片尺寸覆晶基板接單量已創新高紀錄，因此，預估景碩第三季的營收可望季增1成，順利創下歷史新高，毛利率還將優於第二季。此外，亦期待景碩年底將開始小量承接蘋果新一代ARM應用處理器FCCSP訂單。景碩進入第三季旺季，營收、獲利成長備受期待。（來源：時報資訊）
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