軟板HDI 下半年需求強勁
Date: 2013-07-25
News Type:
工業技術研究院產業經濟與趨勢研究中心（IEK）18日表示，受惠智慧手持裝置持續熱銷，有利下半年印刷電路板等電子零元件產業，尤其軟性印刷電路板（FPC）及高密度連接板（HDI），需求最強勁。工研院舉辦第3季產經中心發表會，估計300美元以下的智慧型手機已占整體智慧手機市場逾三成，且比重持續增加，低於100美元的平板電腦，也將成為未來市場重點，這個成長趨勢將為今年電子零元件產值帶來年增率1.8至3.6%的微幅成長。（來源：經濟日報）
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