生益科技8.31億人民幣投資覆銅板專案
Date: 2013-07-25
News Type:
近年來，隨著中西部電子工業的快速發展，PCB產業逐漸向中西部地區轉移已成趨勢。近日，生益科技公告稱，其全資子公司陝西生益啟動年產FR-4、CEM-3各360萬張的高導熱與高密度印製線路板用覆銅板產業化專案，專案總投資預算為8.31億元人民幣，公司擬以增資方式向陝西生益出資不超過4.5億元人民幣。據悉，該項目將於今年8月動工建設，預計2015年投產。(來源：PCB資訊網)
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