高密度連接板需求旺 恐出現供貨短缺
Date: 2013-07-04
News Type:
在三星、RIM等智慧型手機大廠今年大舉導入，宏達電、蘋果新產品持續推出新產品下，任意層高密度連接板需求熱絡，華通電腦7月中下旬將出現供貨短缺情形，燿華電子第3季也將缺貨。過去宏達電、蘋果是最早大量採用高密度連接（HDI）最高階任意層（Any Layer）制程的智慧型手機、平板電腦大廠，今年Any Layer更廣泛被全球大廠採用，一舉引爆需求，全台Any Layer三大廠華通、燿華、欣興電子直接受惠，其中華通的產能相對最少，因此率先傳出7月可能會供不應求。華通表示，智慧型手機、平板電腦第3季就需求熱絡，客戶也是市場大戶，尤其印刷電路板（PCB）同業近年很少擴充Any Layer產能，最快7月中旬就會短缺，華通已在提升擴增產能。(資料來源：經濟日報)
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