U.S. spends $6 billion to build AI center benefiting Taiwanese server manufacturers
Date: 2021-08-25
News Type:
news briefing
The National Science Foundation (NSF) plans to invest US$220 million – equivalent to more than NT$6 billion - to work with Google, Amazon, Intel, and others to establish artificial intelligence research centers throughout 40 states in the US. Since these major companies rely on Taiwanese factories for their cloud servers, Inventec, Quanta, Foxconn, and Wistron will benefit from these investments.
impact analysis
Since the outbreak of the epidemic, social distancing and remote work has driven application markets like 5G communications, cloud AI, and others. The demand for servers as indispensable hardware to these markets has also increased. Nonetheless, during the turbulent terminal market period last year, global servers continuously maintained steady shipments. However, only North America, which accounts for the largest share of global server shipments, held back in the first quarter. This was due to decreased demand from ultra-large-scale data centers and service providers, coupled with a raised base period for shipment growth in 2020Q1. This has rendered the global server market this year to experience a relatively greater rate of recession in the first quarter. However, it is expected that there will be a new wave of demand for servers to support growth in the future alongside the US government’s newly-launched AI center investment plans.
In recent years, Intel and AMD have competed fiercely on server platforms and have successively launched new-generation platform architectures. Since the number of PCB layers required for the new platform is thicker, the number of layers for multilayer HLC boards among these can reach 24 to 30 layers. On the other hand, ABF substrate is furnished with a design requiring 18 to 20 layers. Given the increased number of layers, this also suggests that the product will have stricter requirements for signal transmission loss and stability. Because of this, related applications like high-frequency and high-speed substrate materials or high-speed copper foil should become issues worthy of attention.
More news
- TPCA Show 2025 Reservation! 2024-11-15
- TPCA Show 2024 will be held as scheduled on 10/25 2024-10-24
- TPCA Show 2024 Pre-registration 2024-10-23
- Rajah&Tann:Doing Business in Thailand &Southeast Asia 2024-10-18
- BYD's Thailand factory has been completed, achieving the production target of its 800th new energy vehicle 2024-07-25
- China to Cancel Tariff Concessions on Over 100 Products Under ECFA 2024-07-10
- MKS-阿托科技 大中華區業務總監 蔡政修博士對於大中華PCB市場的展望問與答 2024-06-06
- Dell Technologies announces AI PC, aims to make it standard by 2025 2024-05-20
- TSMC‘s Major Advancement in Advanced Packaging: Silicon Photonics Packaging to Launch in 2025 2024-05-10
- Kinsus Interconnect Technology contemplates setting up an IC substrate plant in Malaysia 2024-02-15
- Mainland China Rewrites the Global Map for Electric Vehicle 2024-02-01
- The spokesman revealed that the government is accelerating investment promotion in the electronics industry, one of the three industries targeted to upgrade the country. 2024-01-20
- CES Debuts Next Week, Unveiling the First Year of AI PC 2024-01-15
- Apple and Amkor to jointly establish a packaging plant - Serving as a downstream US plant for TSMC 2023-12-10
- Breaking Nvidia's Monopoly? 6 Major Tech Giants Developing In-House AI Chips in Unison 2023-10-20
- IDC: Mobile phones will recover next year 2023-09-10
- "Made in India" mobile phone production has exceeded 2 billion, making it the second-largest mobile phone manufacturing country globally. 2023-08-20
- The Taiwan Carbon Solution Exchange formally established 2023-08-10
- Zero inflation in mainland China in June Clouded by the shadow of deflation 2023-07-17
- Apple’s first MR, Vision Pro -- Mixture of Reality Glasses Debuts 2023-06-12