【行業亮點】又一家PCB廠商開啟上市輔導
Date: 2021-03-15
News Type:
3月14日，據江蘇證監局最新披露的輔導備案資訊公示表顯示，福萊盈電子股份有限公司（以下簡稱“福萊盈電子”）擬A股IPO，其保薦機構為平安證券，已於3月2日進行上市輔導備案。
官網資訊顯示，福萊盈電子成立於2010年，目前投資10億人民幣。是一家專業生產單、雙面和多層柔性線路板及多層軟硬結合線路板的高新技術企業。工廠坐落于蘇州新區金楓路189號，現有廠房面積35,000平方米，月產能100,000平方米。
福萊盈電子有成熟的日本業界柔性線路板技術暨管理、臺灣業界的剛柔結合線路板製造的豐富經驗，結合集團公司技術和檢測手段生產各類單面、雙面、鏤空型柔性電路板,產品品質符合國家標準和IPC標準，取得UL認證。產品最小線寬線距25um/25um,微孔技術50um，軟板、軟硬結合板 3-14層（Any layer HDI）,SMT (01005chip,0.35mm pitch BGA),鐳射直接成像線路20um，油墨DI精度25um；月生產能力單雙面及多層板80萬平方米，產品以“比別人低一點的價格、高一點的品質、準確的交期來贏得顧客的信賴”使得正在國內同行中有較高的知名度和競爭力。（新聞來源：集微網）
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