【7/23線上研討會正式開啟！】ISTI董鐘明：亞洲PCB產業的5G部署
Date: 2020-07-16
News Type:
亞洲PCB產業的5G部署
全球引頸期盼的5G商機，因為一場新冠肺炎，吹皺5G一池春水。在5G競局的發展上，全球電路板產業前四強，台、中、日、韓仍各自在5G競局中拼搏，等待疫情結束後的曙光。
臺灣具備先進半導體、PCB高階技術製造優勢，如5G基礎建設中所需的晶片、ABF載板、IC載板等高階產品已開始發酵。陸資電路板廠商，產值成長率達13.9%，是2019年市占率唯一成長的族群，積極建構自主產業鏈外，國家政策助力也讓發展如虎添翼。日本電路板產業雖產值逐年衰退，但在5G競局中，更著重在5G普及後的各式新興利基型應用，掌握高階5G材料技術的日商極具競爭力。韓國電路板廠商之產品佈局，以國家隊切入5G戰場，將由韓國三星、LG、現代等品牌串連產業鏈進行團體戰。
就2020年的整體趨勢看來，5G仍舊是帶動經濟成長的關鍵動能，待疫情結束，相信5G可以再為全球產業注入一股活水。TPCA邀請PCB調研權威機構-工研院產科所(ISTI)董鍾明經理為您解析亞洲PCB產業的5G部署，期待您的參與！
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