蘋果新AirPods若改採SiP設計 南電、景碩、日月光可望受惠
Date: 2019-04-29
News Type:
蘋果 (AAPL-US) 最夯的 AirPods 第 2 代藍牙耳機 23 日正式在台灣上市,同時,最夯的「蘋果先生」也發表報告指出,蘋果今年底推出第 3 代 AirPods 新產品,因改採 SiP 製程,估將影響燿華 (2367-TW)、華通 (2313-TW) 等台廠 PCB 供應鏈,兩業者今 (24) 日對此都不予評論,不過,PCB 業界人士指出,台廠最受惠的,應是南電、景碩與日月光投控。
對於來自郭明錤的預估及猜測,PCB 業界人士依相關產業鏈分布指出,一旦最新的 AirPods 設計改採 SiP(載板封裝) 製程,台廠受惠的應是南電 (8046-TW)、景碩 (3189-TW) 及日月光投控 (3711-TW)。
目前,第 2 代 AirPods 設計 PCB 部分以軟硬結合板設計,其中燿華供應量又超過華通,但今年初以來,市場一直流傳最新的 AirPods 設計將改採 SiP(載板封裝) 製程,包括華通、燿華迄今仍未接獲來自客戶端變更設計的相關訊息,但昨日「分析師」郭明錤形諸研報文字,燿華主管今 (24) 日指出,目前客戶端軟硬結合板需求正常,對於券商報告無從評論。
燿華 2019 年首季營收 48.32 億元,季減 7.55%,年增 8.79%;燿華仍看好今年軟硬結合板市場成長,連續 2 年資本支出,都鎖定在軟硬結合板製程擴張,估今年資本支出將達 10-15 億元。同時,燿華對於蘋果的軟硬結合板生產,原以供應電池控制軟硬結合板在去年供應量大減,改切入蘋果 AirPods 無線耳機軟硬結合板供應為主。
燿華認為,假設第 3 代 AirPods 設計有所變化,燿華仍能從容重返蘋果產品的電池控制軟硬結合板生產,差別只是在分配生產量的多寡而已。
燿華鎖定軟硬結合板製程擴張,主要在燿華去年切入蘋果 AirPods 無線耳機軟硬結合板供應鏈,由於蘋果推新款藍牙耳機,燿華供貨量也將穩定成長。同時,全球車用電子應用穩定增加,燿華在車用 Anylayer HDI、車用軟硬結合板及車用板獲認證廠商數也持續攀升,有助今年車用板業績。
燿華江蘇南通投資設立的新廠也已動工,預計 2019 年年底完工,2020 年第 1 季量產,可銜接上海展華廠生產,設計月產能為每月 90-100 萬呎,高於目前現有的上海展華廠產能。
燿華去年營收 195.4 億元,創新高,年增 7.77%,毛利率為 13.86%,年減 2.02 個百分點,為 6.57 億元,年減 2.58%,每股純益 1.06 元。燿華與華通 均為蘋果藍牙耳機 AirPods 軟硬結合板供應商,今年以來出貨量,均明顯優於去年同期。(新聞來源:鉅亨網)
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