【行業亮點】TPCA新任理事長李長明 暢談PCB在5G商機與智慧製造思維
Date: 2019-03-26
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TPCA(台灣電路板協會)新任理事長欣興電子李長明總經理於當選後首度接受TPCA季刊專訪,暢談在PCB產業發展挑戰、5G議題、接任TPCA理事長後的使命與期許等議題。
對於今年整體PCB產業的看法,李理事長認為台灣潛在威脅是美中貿易戰、大陸環保趨嚴等不利因素,加上大陸現為全球電路板主要生產聚落,雖台灣全球市佔率31.3%仍居冠,但面對同業競爭仍不容小覷,建議台廠後續從強化工廠營運管理著手,如智動化的導入、降低人力成本、提高品質降低生產成本,進而提升競爭力。
5G是否為PCB下一波商機? 李理事長表示5G裝置將在2019年底陸續推出,但因基礎建設與應用層面廣泛,預計在2020年才會開始從資通訊(3C)應用看到成長;然5G在自駕車應用因涉及人身安全的高可靠度技術仍需要克服,預估2022年之後5G在自駕車會比較成熟,;因此5G在應用上迫切所需的高速、低延遲技術以及5G高頻需求訊號的穩定、散熱問題,都將會是PCB產業鏈即將面臨的關鍵因素與挑戰。
而在於當前PCB智慧製造進展上,李理事長表示PCB僅處於工業2.2階段,但並非所有企業都需要有工業4.0,以中小企業來說,工業3.5是最佳混合戰略,特別是台灣PCB產業現有廠房多無法打掉重建,就得透過務實、資源有效運用去做到智動化,畢竟與其做到做得「最好」不如做得「最適」,此看法也呼應工業3.5的價值與精神。
作為TPCA新任理事長,李理事長除了期許將持續協助會員廠商透過協會的平台更密切的交流合作,承襲台灣電路板協會白皮書各構面的長期需求探討,帶領台灣PCB產業持續往下一里程碑邁進,提升台灣PCB產業競爭力。
5G商機在全球如火如荼展開, TPCA亦不斷關注著5G相關議題,今年10/23-25於台北南港展覽館舉辦的「台灣電路板產業國際展覽會(TPCA Show2019) 」更以5G NEXT為主軸,期待串聯起產業上下游,攜手突破新世代的挑戰。 (新聞來源:TPCA)
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