PCB鏈搶5G iPhone先機 有兩原因
Date: 2019-03-04
News Type:
蘋果要推5G iPhone，為何第一波要先敲定PCB供應鏈？主因5G是全新規格設計，牽涉的電路、散熱問題比過往機種更繁雜，在5G新機設計過程中，PCB與新材料扮演通訊傳輸模組化的關鍵，若無法先拍板PCB供應鏈，後續在材料成本控制、訊號品質穩定等問題都無法有效解決。
PCB有「電子業之母」的稱謂，各大廠投入5G研發過程中，首要之務就是解決PCB技術與供貨。由於技術層次更高，5G手機的PCB結合高階材料以模組出貨後，平均銷售價有機會較4G產品跳增2.5倍，出貨總量也將因為堆疊更精密，較4G倍增，讓PCB與新材料價值水漲船高，為台光電、台郡、臻鼎等台廠帶來龐大的商機。
其次，業界也觀察，5G應用進展從第一代降頻28至39GHz的頻段，到手機端初步需要進一步降至約10GHz，也促使材料也出現新選擇，對品牌大廠而言，是成本管控的更多可能選項。
業界分析，台灣PCB與相關材料業者在爭取5G訂單具有利基，背後關鍵在於與客戶密切團隊合作。如台郡、臻鼎分別因應客戶所需，設立專門的部門來跟進設計與測試，這背後是至少三年以上的耕耘期，投入的成本不小。
另一方面，未來在二代以及三代天線應用上，需要更先進的天線設計，也需要更多新的複合材料支援，這部分台資兩大軟板廠皆已密切配合客戶需求。(新聞來源:經濟日報)
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