陶氏電子材料獲PCD&F雜誌新產品導入獎
Date: 2013-05-16
News Type:
陶氏電子材料宣佈其MICROFILL™ THF-100 電鍍銅 榮獲了《印刷電路設計和製造》雜誌 (PCD&F) 的電鍍類新產品導入 (New Product Introduction, NPI) 獎項。MICROFILL™THF-100 電鍍銅透過縮短制程來實現更佳的效能並具有很高的可靠度。從2009年開始，陶氏的新產品在PCD&F的除膠渣、表面處理、電解電鍍和影像成像類別已經榮獲了五項新產品導入獎。“我們非常高興地祝賀陶氏再次榮獲新產品導入獎，可説明滿足客戶在高密度互連解決方案的各種需求。(來源：PCD&F)
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