【台灣】5G、AI 成2019年半導體產業顯學
Date: 2019-01-08
News Type:
2019年5G、AI時代來臨，串連起物聯網、自駕車、區塊鏈、智能環境、語音識別等應用崛起，帶來半導體產業一連串的變化與商機，台灣半導體產業聚落在全球佔有一席之地，從上游晶圓代工到IC設計可望雨露均霑，而產業龍頭挾其豐沛資源將優先受惠。
無論是5G、AI或是其他科技趨勢都跳脫不出台積電營運範疇，外資點名台積電優先受惠，物聯網、高效能運算及車用在2019年呈現雙位數成長，7奈米先進製程技術定於一尊，營收比重將快速攀升。世界先進則持續受惠於外商IDM客戶委外生產趨勢，車用營收比重逐季攀升。
IC設計龍頭聯發科在5G、AI開發腳步領先台灣地區同業，連帶在物聯網、車用也多有著墨，並與國際大廠合作開發，其中手機芯片，5G多模調製解調器芯片Helio M70為Sub-6GHz頻段中功能最強大的芯片，今年量產出貨。日前發表P90芯片搭載全新超強AI引擎APU 2.0，AI處理速度大幅提升，在國外專業評比網站跑分勝出競爭對手。
在車用芯片領域，聯發科開發Autus平台，為自動駕駛提供AI、毫米波、機器學習及先進視覺處理解決方案。為物聯網所設計研發的產品項目超過一百萬種消費性電子產品，高效能、低耗功特性更獲得國際品牌大廠採用。 (新聞來源:聯合報)
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