【行業亮點】攻5G商機，PCB廠箭在弦上
Date: 2018-11-08
News Type:
受惠於5G、AI、車用三大領域，未來三年PCB市場仍然火熱。其中高頻高速的5G通訊，被視為啟動其他領域多元應用發展的基礎，業者也預估最快2020年將會正式商用，許多廠商正積極擴廠提升產能與設備技術，以符合市場需求，期望在新科技來臨時能夠搶先商機。
台燿受惠於高頻、網通類產品需求穩定。針對未來5G通訊，台燿追加資本支出5億元於新竹擴廠，預計明年第二季開始量產，另外公司也從傳統PCB跨足IC載板，有望為公司營運挹注新的力量。
台光電受惠於客戶拉貨旺季來臨，日前在法說會上表示，為提升產能以及量產5G材料，看好湖北PCB的聚落效應，預計提高資本支出至17.72億元新台幣，並在湖北黃石擴建新廠、崑山設立研發中心，預估增加銅箔基板單月60萬張的產能。
聯茂近年專攻網通基地台、服務器、儲存設備等3S產品應用，隨著服務器、5G應用逐漸增加，公司日前表示將選定在江西擴產，預計明年第二季會有產能開出，屆時將擁有單月60萬張的產能，以主攻網通產品。
業者表示，為符合5G高頻高速、低損耗、大數據承載等特性，未來不論是前端製程或是終端服務，都將有重大的改變，而5G對於零組件的要求也提高不少，以PCB來說不僅材料規格變嚴苛、基板加工也更難，隨著製程技術的提升切入門檻也變高，預估未來市場會更加集中，產業將逐漸走向恆大化發展的趨勢。 （新聞來源：工商時報）
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