SynPower announces its move towards 10/10 um wet process equipment solutions
Date: 2018-07-26
News Type:
SynPower recently announced its next generation solutions for wet process equipment in the 10/10um line width. The President of SynPower, Alan Lin, said that in competition with countries currently in the ultra-fine line development of PCBs, the company will continue to enhance its upstream-downstream integration and information connection, connect industry experts and industry needs in Taiwan, and invest in the R&D of next-generation wet process equipment to provide the best product solutions in the industry.
The announcement included the production of vertical and horizontal roll-to-roll continuous copper sulfate plating equipment, horizontal roll-to-roll non-contact liquid film technology, ultra-fine line development-etching-striping machines (DES), and innovative positive pressure etching technology.
The roll-to-roll plating line is based on the Japanese technology transfer and was jointly designed with Taiwan’s wet process experience. This product is suitable for plating FPC (flexible printed circuit), complete PCBs, circuits, plating through hole (PTH), blind via hole (BVH), and buried via hole (BVH). Its high current density can facilitate plating efficiency and reduce space, and the non-contact electroplating area allows for a uniform reaction with chemical solutions, as well as reduces the risk of collision, which may damage the substrates. The horizontal non-contact plating application with global patent technology can enhance the complete non-contact of PCBs with equipment through liquid film technology, which is ideal for the nickel and chemical copper processes of COF (chip on film) products. Furthermore, to strengthen the PCBs in mSAP (modified-semi-additive process) applications, SynPower has also invested in a fast etching machine with a unique and innovative positive pressure technology to achieve 10/10 um ultra-fine line etching.
President Alan Lin also expressed that SynPower would continue to invest in resource R&D, upgrade Taiwan’s high-end wet process solutions, enhance the competitive advantage of the industry with other countries, and assist Taiwan’s PCB manufacturing industry to march towards the ultra-fine line field. (News source: Economic Daily News)
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