聯策科技發表濕製程設備 邁向10/10um 解決方案
Date: 2018-07-17
News Type:
聯策科技日前發表次世代濕製程設備10/10um 解決方案，聯策科技董事長林文彬表示，面對目前電路板朝超威細線路發展，與各國競爭，聯策科技也持續進行上下游整合，信息串連並且結合台灣業界專家與產業需求，投入次世代濕製程設備研發，提供業界最佳產品解決方案。
此次發表包含垂直式、水平式捲對卷連續硫酸銅電鍍設備、水平卷對卷非接觸液膜技術與微細線路顯影－蝕刻－剝膜機（ＤＥＳ），創新正壓蝕刻技術。
卷對卷電鍍線以日本技轉基礎，結合台灣濕製程經驗而設計，適合FPC板全板、線路、通孔與盲埋孔的電鍍應用。其電流密度高以利電鍍效率與縮減空間，同時電鍍區非接觸可使藥液均勻反應又可降低傷害基材碰撞風險。而具備全球專利技術的水平非接觸式化鍍應用，透過液膜技術使板材於運行中完全不會接觸設備，非常適合COF等級產品在化鎳、化學銅製程。此外，為強化電路板於MSAP製程應用，聯策科技亦投入獨特創新的正壓技術的快速蝕刻機，實現10/10um超威細線路蝕刻。
林文彬董事長表示，聯策科技將持續投入資源研發，提升台灣高階濕製程解決方案，擴大業界與其它國家的競爭優勢，協助台灣電路板邁向超威細線路發展。 (新聞來源:經濟日報)
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