LCP軟板製程難度高暫難全面進場 供應鏈各有因應
Date: 2018-06-12
News Type:
嘉聯益開發多年的LCP 軟板天線產品傳獲蘋果青睞，大舉現增籌資近30 億元台幣規劃全新製程的桃園觀音廠，是全球進入5G 通訊時代之前，最讓市場5G 有感的一件事。
此事件也使整個軟板供應鏈「動起來」，臻鼎及台郡都表示，不會在軟板天線此領域缺席，而上游原物料廠商台虹及新揚、亞電均更積極投入5G通訊產品開發。台虹及新揚也相繼完成新材料，以因應 5G 通訊需求。
場先前傳出，蘋果公司以高達3 億美元資金，提供包括雷射鑽孔機、雷射直接成像曝光機、自動光學檢測及其他各類相關製程設備給嘉聯益新廠，讓嘉聯益與日本村田製作所((Murata) 一起成為蘋果LCP(液晶基材) 天線軟板主要供應廠。
全球最快2019年將進入高頻、高速5G 通訊時代，頭端設備廠、終端手持裝置廠無不傾全力爭奪商機，5G 通訊時代市場需求改變，市場可能引爆原物料供應鏈大洗牌，嘉聯益的投入LCP 軟板天線的生產，應只是個開場而已。 (新聞來源：鉅亨網)
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