大陸高端芯片研製已具備基礎
Date: 2018-04-30
News Type:
當前大陸在光電子高端芯片研製上已具備基本條件,無論技術積累還是資金投入,以及高端核心人才的培養和儲備,都具備了一定基礎條件。只要大陸選定面向未來信息網絡急需的1—2類核心關鍵光電子芯片,集中資源,從設計、研發、器件製備到封裝測試進行綜合佈局,同時通過大陸引導、地方和企業的參與,構建完善的光電子芯片加工工藝平台,相信高端芯片研發將不斷取得新的突破。
據了解,為實現自主創新發展,大陸於2008年實施了大陸科技重大專項“極大規模集成電路製造裝備及成套工藝”,經過9年攻關,成功打造了大陸集成電路製造業創新體系。 9年來,大陸主流工藝水平提升了5代,55、40、28納米三代成套工藝研發成功並實現量產,22、14納米先導技術研發取得突破,已研製成功30多種高端裝備和靶材、拋光液等上百種材料產品,性能達到國際先進水平。封裝企業也從低端進入高端,三維高密度集成技術達到了國際先進水平。這一系列從無到有的突破,使大陸集成電路製造技術體系和產業生態得以建立和完善。 (新聞來源:中國電子報、電子信息產業網)
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